Fujitsu Intel Xeon E-2334. Processor family: Intel Xeon E, Processor socket: LGA 1200 (Socket H5), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 128 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16+1x4, 2x8+1x4, 1x8+3x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0, AVX-512. Intel® Turbo Boost Technology 2.0 frequency: 4.8 GHz, Maximum Enclave Size Support for Intel® SGX: 0.5 GB. Package type: Tray

Specification

Product
Product id	839991
Brand	Fujitsu Technology Solutions
Partnr	PYBCP63E2
EAN/UPC code
Processor
Processor manufacturer	Intel
Processor family	Intel Xeon E
Processor model	E-2334
Component for	Server/Workstation
Processor socket	LGA 1200 (Socket H5)
Processor cores	4
Processor threads	8
Processor base frequency	3.4 GHz
Processor boost frequency	4.8 GHz
Thermal Design Power (TDP)	65 W
Processor lithography	14 nm
System bus rate	8 GT/s
Processor operating modes	64-bit
Processor cache	8 MB
Processor cache type	Smart Cache
Processor ARK ID	212258
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM
Memory channels	Dual-channel
ECC	Y
Graphics
On-board graphics adapter	N
Discrete graphics adapter	N
Discrete graphics adapter model	Not available
Features
Execute Disable Bit	Y
Idle States	Y
Thermal Monitoring Technologies	Y
Maximum number of PCI Express lanes	20
PCI Express slots version	4.0
PCI Express configurations	1x16+1x4, 2x8+1x4, 1x8+3x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0, AVX-512
Scalability	1S
CPU configuration (max)	1
Market segment	Server
Harmonized System (HS) code	85423119
Export Control Classification Number (ECCN)	5A992CN3
Commodity Classification Automated Tracking System (CCATS)	G167599
Processor special features
Intel® AES New Instructions (Intel® AES-NI)	Y
Enhanced Intel SpeedStep Technology	Y
Intel Trusted Execution Technology	Y
Intel® Memory Protection Extensions (Intel® MPX)	Y
Intel® Hyper Threading Technology (Intel® HT Technology)	Y
Intel® Turbo Boost Technology	2.0
Intel® Turbo Boost Technology 2.0 frequency	4.8 GHz
Intel® Transactional Synchronization Extensions	N
Intel® Optane™ DC Persistent Memory Supported	N
Intel® Boot Guard	Y
Maximum Enclave Size Support for Intel® SGX	0.5 GB
Intel® vPro™ Platform Eligibility	Y
Intel® OS Guard	Y
Intel® Secure Key	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel Virtualization Technology (VT-x)	Y
Intel Virtualization Technology for Directed I/O (VT-d)	Y
Intel 64	Y
Intel Software Guard Extensions (Intel SGX)	Y
Operational conditions
Tjunction	100 °C
Packaging data
Package type	Tray
Technical details
Supported memory types	DDR4-SDRAM
Launch date	Q3'21
Status	Launched
Servicing status	Baseline Servicing
Other features
Maximum internal memory	128 GB