SR630 V2 Gold 5317 12C 150W 3.0GHz

 

Lenovo
Not in stock
€ 1.869,74
€ 2.262,38 incl 21% VAT
Lenovo Xeon Intel Gold 5317. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Specification

Product
Product id 948347
Brand Lenovo
Partnr 4XG7A63412
EAN/UPC code 889488530892
Processor
Processor manufacturer Intel
Processor family Intel Xeon Gold
Processor series Intel Xeon Gold 5000 Series
Processor model 5317
Processor codename Ice Lake
Processor generation Intel Xeon Scalable 3rd Gen
Component for Server/Workstation
Processor socket LGA 4189
Processor cores 12
Processor threads 24
Processor base frequency 3 GHz
Processor boost frequency 3.6 GHz
Thermal Design Power (TDP) 150 W
Processor lithography 10 nm
System bus rate 11.2 GT/s
Processor operating modes 64-bit
Processor cache 18 MB
Memory
Maximum internal memory supported by processor 6000 GB
Memory types supported by processor DDR4-SDRAM
Memory channels Octa-channel
ECC Y
Graphics
On-board graphics adapter N
Discrete graphics adapter N
On-board graphics adapter model Not available
Discrete graphics adapter model Not available
Features
Execute Disable Bit Y
Maximum number of PCI Express lanes 64
PCI Express slots version 4.0
Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512
Scalability 2S
Embedded options available Y
Market segment Server
Harmonized System (HS) code 8542310001
Export Control Classification Number (ECCN) 5A992CN3
Commodity Classification Automated Tracking System (CCATS) G178966
Processor special features
Intel® AES New Instructions (Intel® AES-NI) Y
Intel Trusted Execution Technology Y
Intel® Speed Shift Technology Y
Intel® Hyper Threading Technology (Intel® HT Technology) Y
Intel® Turbo Boost Technology 2.0
Intel® Transactional Synchronization Extensions Y
Intel® Total Memory Encryption Y
Intel® Optane™ DC Persistent Memory Supported Y
AVX-512 Fused Multiply-Add (FMA) units 2
Intel® Crypto Acceleration Y
Intel® Platform Firmware Resilience Support Y
Maximum Enclave Size Support for Intel® SGX 64 GB
Intel® Deep Learning Boost (Intel® DL Boost) Y
Intel® Resource Director Technology (Intel® RDT) Y
Intel® Volume Management Device (VMD) Y
Intel® Run Sure Technology Y
Mode-based Execute Control (MBE) Y
Intel VT-x with Extended Page Tables (EPT) Y
Intel Virtualization Technology (VT-x) Y
Intel Virtualization Technology for Directed I/O (VT-d) Y
Intel 64 Y
Intel Software Guard Extensions (Intel SGX) Y
Operational conditions
Tcase 84 °C
Technical details
Supported memory types DDR4-SDRAM
Target market Cloud Computing
Number of UPI links 3
Memory speed (max) 2933 MHz
Launch date Q2'21
Status Launched
Weight & dimensions
Processor package size 77.5 x 56.5 mm
Other features
Maximum internal memory 6000 GB