Intel Xeon Gold 6330. Processor family: Intel® Xeon®, Processor socket: FCLGA4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Package type: Retail box

Specification

Product
Product id	757434
Brand	Intel
Partnr	BX806896330
EAN/UPC code	5032037224420
Warranty (months)	36 months
Processor
Processor manufacturer	Intel
Processor family	Intel Xeon
Processor series	Intel Xeon Gold 6000 Series
Processor model	6330
Processor codename	Ice Lake
Box	N
Cooler included	N
Component for	Server/Workstation
Processor socket	FCLGA4189
Processor cores	28
Processor threads	56
Processor base frequency	2 GHz
Processor boost frequency	3.1 GHz
Thermal Design Power (TDP)	205 W
Processor lithography	10 nm
System bus rate	11.2 GT/s
Processor operating modes	64-bit
Processor cache	42 MB
Memory
Memory types supported by processor	DDR4-SDRAM
Memory channels	Octa-channel
ECC	Y
Graphics
On-board graphics adapter	N
Discrete graphics adapter	N
On-board graphics adapter model	Not available
Discrete graphics adapter model	Not available
Features
Execute Disable Bit	Y
Maximum number of PCI Express lanes	64
PCI Express slots version	4.0
Supported instruction sets	SSE4.2, AVX, AVX 2.0, AVX-512
Scalability	2S
Embedded options available	Y
Market segment	Server
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A992CN3
Commodity Classification Automated Tracking System (CCATS)	G178966
Processor special features
Intel® AES New Instructions (Intel® AES-NI)	Y
Intel Trusted Execution Technology	Y
Intel® Speed Shift Technology	Y
Intel® Hyper Threading Technology (Intel® HT Technology)	Y
Intel® Turbo Boost Technology	2.0
Intel® Transactional Synchronization Extensions	Y
Intel® Total Memory Encryption	Y
Intel® Optane™ DC Persistent Memory Supported	Y
AVX-512 Fused Multiply-Add (FMA) units	2
Intel® Crypto Acceleration	Y
Intel® Platform Firmware Resilience Support	Y
Maximum Enclave Size Support for Intel® SGX	64 GB
Intel® Deep Learning Boost (Intel® DL Boost)	Y
Intel® Resource Director Technology (Intel® RDT)	Y
Intel® Volume Management Device (VMD)	Y
Intel® Run Sure Technology	Y
Mode-based Execute Control (MBE)	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel Virtualization Technology (VT-x)	Y
Intel Virtualization Technology for Directed I/O (VT-d)	Y
Intel 64	Y
Intel Software Guard Extensions (Intel SGX)	Y
Operational conditions
Tcase	86 °C
Packaging data
Package type	Retail box
Technical details
Supported memory types	DDR4-SDRAM
Number of UPI links	3
Memory speed (max)	2933 MHz
Launch date	Q2'21
Status	Launched
Weight & dimensions
Processor package size	77.5 x 56.5 mm
Other features
Maximum internal memory	6000 GB