Intel® Gaussian & Neural Accelerator
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.

Intel® Deep Learning Boost (Intel® DL Boost)
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

Intel® Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

Intel® Thermal Velocity Boost
Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.

Intel® Turbo Boost Max Technology 3.0
Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.

Intel® Hyper-Threading Technology
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Specification

Product
Product id	875776
Brand	Intel
Partnr	BX8071513900
EAN/UPC code	5032037260176
Warranty (months)	36 months
Processor
Processor manufacturer	Intel
Processor family	Intel Core i9
Processor model	i9-13900
Processor codename	Raptor Lake
Processor generation	Intel Core i9-13xxx
Box	Y
Processor socket	LGA 1700
Processor cores	24
Processor threads	32
Performance cores	8
Efficient cores	16
Processor boost frequency	5.6 GHz
Performance-core base frequency	2 GHz
Efficient-core base frequency	1.5 GHz
Efficient-core boost frequency	4.2 GHz
Processor operating modes	64-bit
Processor cache	36 MB
Processor cache type	Smart Cache
L2 cache	32768 KB
Performance-core boost frequency	5.2 GHz
Maximum turbo power	219 W
Processor base power	65 W
Maximum number of DMI lanes	8
Memory
Maximum internal memory supported by processor	128 GB
Memory types supported by processor	DDR4-SDRAM, DDR5-SDRAM
Memory channels	Dual-channel
ECC	Y
Memory bandwidth (max)	89.6 GB/s
Graphics
On-board graphics adapter	Y
Discrete graphics adapter	N
On-board graphics adapter model	Intel UHD Graphics 770
On-board graphics adapter outputs supported	Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1
On-board graphics adapter dynamic frequency (max)	1650 MHz
On-board graphics adapter base frequency	300 MHz
Number of displays supported (on-board graphics)	4
On-board graphics adapter OpenGL version	4.5
On-board graphics adapter DirectX version	12.0
On-board graphics adapter maximum resolution (DisplayPort)	7680 x 4320 Pixels
On-board graphics adapter maximum resolution (HDMI)	4096 x 2160 Pixels
On-board graphics adapter maximum resolution (eDP - Integrated Flat Panel)	5120 x 3200 Pixels
On-board graphics adapter refresh rate at maximum resolution (HDMI)	60 Hz
On-board graphics adapter refresh rate at maximum resolution (eDP - Integrated Flat Panel)	120 Hz
On-board graphics adapter refresh rate at maximum resolution (DisplayPort)	60 Hz
On-board graphics adapter ID	0xA780
Discrete graphics adapter model	Not available
Number of execution units	32
Multi-Format Codec Engines	2
Features
Execute Disable Bit	Y
Idle States	Y
Thermal Monitoring Technologies	Y
Maximum number of PCI Express lanes	20
Use conditions	Workstation, PC/Client/Tablet
PCI Express slots version	4.0, 5.0
PCI Express configurations	1x16+1x4, 2x8+1x4
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Direct Media Interface (DMI) Revision	4.0
Scalability	1S
CPU configuration (max)	1
Embedded options available	Y
Market segment	Desktop
Harmonized System (HS) code	8542310001
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	740.17B1
Processor special features
Intel® AES New Instructions (Intel® AES-NI)	Y
Enhanced Intel SpeedStep Technology	Y
Intel Trusted Execution Technology	Y
Intel® Speed Shift Technology	Y
Intel® Clear Video HD Technology (Intel® CVT HD)	Y
Intel® Hyper Threading Technology (Intel® HT Technology)	Y
Intel® Turbo Boost Technology	2.0
Intel® Quick Sync Video Technology	Y
Intel® Thermal Velocity Boost	Y
Intel® Turbo Boost Max Technology 3.0 frequency	5.5 GHz
Intel® Thermal Velocity Boost Frequency	5.6 GHz
Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0	Y
Intel® Control-flow Enforcement Technology (CET)	Y
Intel® Boot Guard	Y
Intel® Deep Learning Boost (Intel® DL Boost)	Y
Intel® Thread Director	Y
Intel® Volume Management Device (VMD)	Y
Mode-based Execute Control (MBE)	Y
Intel Turbo Boost Max Technology 3.0	Y
Intel® OS Guard	Y
Intel® Secure Key	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel® Standard Manageability (ISM)	Y
Intel Virtualization Technology (VT-x)	Y
Intel Virtualization Technology for Directed I/O (VT-d)	Y
Intel 64	Y
Operational conditions
Tjunction	100 °C
Technical details
OpenCL version	3.0
Launch date	Q1'23
Weight & dimensions
Processor package size	45 x 37.5 mm
Other features
Graphics output	eDP 1.4b, DP 1.4a, HDMI 2.1