Product |
Product id |
888970 |
Brand |
Intel |
Partnr |
CM8070104291318 |
EAN/UPC code |
5415247274605 |
Warranty (months) |
12 months |
Processor |
Processor manufacturer |
Intel |
Processor family |
Intel Core i3 |
Processor model |
i3-10100F |
Processor codename |
Comet Lake |
Processor generation |
Intel Core i3-10xxx |
Box |
N |
Cooler included |
N |
Component for |
PC |
Processor socket |
LGA 1200 (Socket H5) |
Processor cores |
4 |
Processor threads |
8 |
Processor base frequency |
3.6 GHz |
Processor boost frequency |
4.3 GHz |
Thermal Design Power (TDP) |
65 W |
Processor lithography |
14 nm |
System bus rate |
8 GT/s |
Processor operating modes |
64-bit |
Processor cache |
6 MB |
Processor cache type |
Smart Cache |
Memory bandwidth supported by processor (max) |
41.6 GB/s |
Processor ARK ID |
203473 |
Memory |
Maximum internal memory supported by processor |
128 GB |
Memory types supported by processor |
DDR4-SDRAM |
Memory clock speeds supported by processor |
2666 MHz |
Memory channels |
Dual-channel |
ECC |
N |
Graphics |
On-board graphics adapter |
N |
Discrete graphics adapter |
N |
On-board graphics adapter model |
Not available |
Discrete graphics adapter model |
Not available |
Features |
Execute Disable Bit |
Y |
Idle States |
Y |
Thermal Monitoring Technologies |
Y |
Maximum number of PCI Express lanes |
16 |
PCI Express slots version |
3.0 |
PCI Express configurations |
1x16, 2x8, 1x8+2x4 |
Supported instruction sets |
SSE4.1, SSE4.2, AVX 2.0 |
Thermal solution specification |
PCG 2015C |
Scalability |
1S |
CPU configuration (max) |
1 |
Embedded options available |
N |
Market segment |
Desktop |
Harmonized System (HS) code |
85423119 |
Export Control Classification Number (ECCN) |
5A992C |
Commodity Classification Automated Tracking System (CCATS) |
G077159 |
Processor special features |
Intel® AES New Instructions (Intel® AES-NI) |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel Trusted Execution Technology |
N |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Y |
Intel® Turbo Boost Technology |
2.0 |
Intel® Identity Protection Technology (Intel® IPT) |
Y |
Intel® Thermal Velocity Boost |
N |
Intel® Turbo Boost Technology 2.0 frequency |
4.3 GHz |
Intel® Transactional Synchronization Extensions |
N |
Intel® Optane™ Memory Ready |
Y |
Intel® Boot Guard |
Y |
Intel® vPro™ Platform Eligibility |
N |
Intel Turbo Boost Max Technology 3.0 |
N |
Intel® OS Guard |
Y |
Intel Stable Image Platform Program (SIPP) |
N |
Intel® Secure Key |
Y |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel Virtualization Technology (VT-x) |
Y |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
Intel 64 |
Y |
Intel Software Guard Extensions (Intel SGX) |
Y |
Operational conditions |
Tjunction |
100 °C |
Packaging data |
Package type |
Retail box |
Technical details |
Supported memory types |
DDR4-SDRAM |
Launch date |
Q4'20 |
Status |
Launched |
Weight & dimensions |
Processor package size |
37.5 x 37.5 mm |
Other features |
Maximum internal memory |
128 GB |