Your notebook or small-form-factor machine can now experience the latest, cutting-edge memory technology with Kingston FURY™ Impact DDR5. With Intel® XMP 3.0 Certified SODIMM kit capacities of up to 64GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. On Plug N Play* enabled modules, Kingston FURY Impact DDR5 automatically overclocks, giving your system a boost in performance without having to enable a profile. Modules featuring XMP 3.0 profiles can overclock to the highest frequency published, up to 6400MT/s, by selecting the profile in BIOS settings.

Mighty DDR5 SODIMM performance
With a starting speed of 4800MT/s, DDR5 is 50% faster than DDR4 for a boost in gaming, rendering, and multitasking.

Plug N Play automatic overclocking functionality*
Kingston FURY Impact DDR5’s PnP modules automatically overclock to the highest listed speed.

Intel® XMP 3.0 Certified
Maximise memory performance with advanced pre-optimised timings, speed and voltage for overclocking.

Low Power Consumption, Increased efficiency
Keep your system cool and efficient with Kingston FURY Impact DDR5’s low power draw.

Improved stability with on-die ECC
Maintain data integrity while hitting overclocking speeds.

Specification

Product
Product id	876414
Brand	Kingston Technology
Partnr	KF556S40IB-32
EAN/UPC code	740617331653
Warranty (months)	Lifetime
Memory
Internal memory	32 GB
Internal memory type	DDR5
Memory layout (modules x size)	1 x 32 GB
Module configuration	4096M x 64
Refresh row cycle time	295 ns
Row cycle time	48 ns
Row active time	28.56 ns
Weight & dimensions
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	8.88 g
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Features
Component for	Notebook
Memory form factor	262-pin SO-DIMM
Buffered memory type	Unregistered (unbuffered)
ECC	N
CAS latency	40
On-Die ECC	Y
Memory ranking	2
Memory data transfer rate	5600 MT/s
Memory voltage	1.1 V
Intel Extreme Memory Profile (XMP)	Y
Intel Extreme Memory Profile (XMP) version	3.0
SPD profile	Y
Programming power voltage (VPP)	1.8 V
Cooling type	Heatsink
Lead plating	Gold
JEDEC standard	Y
Other features
Country of origin	China, Taiwan
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	26.72 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case weight	812.13 g
Quantity per master (outer) case	25 stuk(s)